Blind and buried via plate
Board layer: six-layer board
Substrate material: FR4
Surface Treatment: Immersiongold+Blind & BurueedVias
Impedance requirement: Yes
Substrate material: FR4
Surface Treatment: Immersiongold+Blind & BurueedVias
Impedance requirement: Yes
Keyword:
Category:
Description
Board layer: six-layer board
Substrate material: FR4
Surface Treatment: Immersiongold+Blind & BurueedVias
Impedance requirement: Yes
Related Products
Inquiry

HuiZhou SunKing Circuits Electronics Co.,Ltd.
Service Hotline:
0752-3619218-8039
Company Address:
XinLe Industry Maan Town Huizhou City,Guangdong Province,China
Copyright © HuiZhou SunKing Circuits Electronics Co.,Ltd All rights reserved.