Manufacturing capacity
Item
|
Production capacity
|
Model production capacity
|
Board size
|
20"x40"
|
20"x40"
|
The highest level
|
16
|
20
|
Thickness
|
0.3mm--5.0mm
|
0.2mm--6.0mm
|
The smallest product aperture
|
0.2mm
|
0.15mm
|
Thickness ratio
|
8:1
|
10:1
|
Line width / Line gap(Outer)
|
3.0mil/3.0mil
|
2.5mil/2.5mil
|
3.0mil/2.6mil
|
2.5mil/2.5mil
|
|
Impedance control
|
+(-)10%
|
+(-)5%
|
Bottom copper thickness: |
10 OZ / 10 OZ
|
10 OZ / 10 OZ
|
Electroplating thick gold
|
Au 0.8 - 60U"
|
Au 0.8 - 60U"
|
Electroplating thick gold
|
Ni50-200U"
|
Ni 50-300U"
|
Chemical gold
|
Au 0.8 - 10U"
|
Au 0.8 - 10U"
|
Ni 50-200U"
|
Ni 100-300U"
|
|
Green oil thickness
|
0.2mil --1.2mil
|
0.2mil --1.2mil
|
Blue glue thickness
|
4mil / 20mil
|
4mil / 20mil
|

HuiZhou SunKing Circuits Electronics Co.,Ltd.
Service Hotline:
0752-3619218-8039
Company Address:
XinLe Industry Maan Town Huizhou City,Guangdong Province,China
Copyright © HuiZhou SunKing Circuits Electronics Co.,Ltd All rights reserved.